In recent years, the world is facing the problem of the increasing scarcity of traditional fuel energy and the increasing harm to the environment. Seeking new energy sources, reducing pollution, and changing the human energy structure have become common goals of all countries in the world. The photovoltaic industry is a common concern for governments as a new non-polluting energy source. Therefore, in order to maintain long-term sustainable development, governments have continuously introduced favorable policies to promote the development of the photovoltaic industry, which has greatly promoted the development of the photovoltaic industry and led to the rapid development of the wafer wafer cutting blade manufacturing industry.
In the army of new energy enterprises in China, Henan Xinda New Materials Co., Ltd. (hereinafter referred to as “Xinda New Materials” or the company), as the main supplier of special wafers for cutting wafers in the domestic photovoltaic industry, stands out with its strong strength. .
For a long time, with the leading technical advantages, stable product quality and perfect after-sales service, Xindaxin Materials has achieved excellent performance and maintained high-quality customer resources, and established a long-term stable cooperative relationship with it. Major customers include leading companies in the photovoltaic industry such as Jiangxi LDK, Yingli New Energy, Huihui Sunshine and Jinglong Group.
On the day of June 25th, Xinda New Materials ushered in a new development journey. The company publicly issued 35 million shares and officially went public.
It is reported that in order to improve the company's independent innovation capability and core competitive advantages, the company will invest in the "annual production of 25,000 tons of solar crystal wafer cutting special blade material expansion project", "crystal wafer cutting waste mortar recycling and reuse Project", "annual production of 8000 tons of silicon carbide special blade material for semiconductor wafer cutting", "R & D center project" and "other working capital projects related to the main business".
Technical quality "double hard"
As we all know, the photovoltaic industry is a relatively growth industry. The infinite nature and environmental protection of solar energy have unparalleled advantages and broad development prospects. With the rapid development of the photovoltaic industry, the demand for cutting wafers for crystalline silicon wafers is increasing, and the industry in which new and new materials are located has great potential for development at home and abroad.
Most worth mentioning is that the company's production process and product quality have reached the level of international similar products, and this advantage has accelerated the rapid take-off of enterprises.
As an important supplier of the main solar crystal wafer production enterprises in China, Xindaxin Materials has core technical advantages in product development and production process of crystalline silicon wafer cutting materials. The core members of the company's technology research and development team have more than 20 years of experience in the preparation of silicon carbide powder and related industries in production management, technology research and development, equipment maintenance, etc. After years of exploration and accumulation, the company has independently developed and modified the dry ball mill grading system. Ultrasonic vibrating screen and other industry-leading professional equipment have formed their own production system of crystalline silicon wafer cutting edge material, leading other enterprises in the same industry in terms of product quality, product yield and production efficiency.
On December 31, 2008, the company was recognized as a national high-tech enterprise (Certificate No.: GR200841000227); in 2007 and 2008, the company was awarded the “Carbon Silicone Production Industry of Abrasives Industry” by the Abrasives and Abrasives Branch of China Machine Tool Industry Association. Top Ten Titles; In 2009, the company won the “Henan Province Comprehensive Utilization Certification Certificate”.
The dry ball mill grading equipment independently researched and developed by the company can greatly improve the product yield and product quality during the grinding process after the raw materials are crushed. The industry's adoption of general grinding technology yields about 45%, while the new large new materials use this technology to achieve a yield of 52%, and the use of this technology after grinding the product particle size distribution is more uniform, can achieve better Crystal silicon wafer cutting effect. In addition, the company is also proficient in airflow multi-stage grading technology, pickling cleaning technology and ultrasonic screening technology. The various technologies are first proposed by the company on the basis of its own mature process technology, after the company's technical personnel have conducted a large number of tests. The production technology has remarkable characteristics of energy saving, high efficiency and stable product quality.
In addition, the company's "crystal silicon cell cutting and cutting special blade material" technical achievements were awarded the "Scientific and Technological Achievements Appraisal Certificate" issued by the Henan Provincial Science and Technology Department. The appraisal opinion indicates that the technical achievements are in the equipment and process of crushing, grading and fine screening. A number of innovations have reached the domestic leading level and the product performance is excellent. At present, the scientific and technological achievements have been widely used in the production of various specifications of crystalline silicon wafer cutting blades.
In terms of improving product quality, the company can also be said to have made a lot of effort. It is understood that crystalline silicon wafer cutting edge material is an indispensable special material in the production of solar cell crystal silicon wafer. The performance of the product, the stability of the quality and the consistency of the particle shape will largely affect the cutting of the crystalline silicon wafer. Yield and production efficiency. In order to ensure product quality and reduce production costs, downstream crystalline silicon wafer manufacturers are more cautious in purchasing cutting edge material suppliers, and the product quality requirements are very strict. After the downstream manufacturers certification, other similar products are difficult to replace. The company has maintained a good cooperative relationship with major PV industry companies for a long time, and provides various specifications of wafer cutting blades for different companies' cutting process requirements. The company has a unique processing technology in the key production links such as grinding, grading and pickling, so that the products have high quality front and grain composition. Therefore, the company's products have the advantages of high wear resistance, good cutting performance and stable product quality.
It is understood that China is the world's largest producer and exporter of silicon carbide. Limited by the production cost factors of electricity, environmental protection, labor, etc., the developed countries such as the United States, Germany, and Japan mainly produce SiC raw materials through sourcing in China or setting up processing plants in China, and deep processing into high value-added silicon carbide products abroad. In the field of wafer cutting, precision ceramic grinding and so on.
In addition, the vigorous development of domestic PV industry, semiconductor and other industries has promoted the extension of China's silicon carbide industry chain and the upgrading of product structure. The market demand for silicon carbide high-end products of crystalline silicon wafer cutting blades is strong. Domestic enterprises have gradually mastered the preparation technology of silicon carbide ultrafine powder through independent research and development, and realized the optimization and upgrading of product structure, which has led to the growing demand for silicon carbide raw materials in the domestic market.
According to the person in charge of the company, Xindaxin Materials has established long-term and stable cooperative relations with major domestic silicon carbide production enterprises and participated in Longhai Technology. Therefore, the company has significant advantages in raw material procurement.
In terms of supply, the company has always maintained a stable and reliable "good tradition", and its high sense of responsibility has been appreciated by customers. At present, there are few enterprises in China that can produce wafer silicon cutting blades on a large scale. At present, China's annual production capacity of 5,000 tons or more of crystalline silicon wafer cutting blade manufacturing enterprises does not exceed ten, far from meeting solar cell wafers and Cutting production requirements for semiconductor wafers. The company's sales of crystalline silicon wafer cutting blades have exceeded 23,000 tons, with a continuous and stable supply capacity, and significant economies of scale.
Sincerity in the line to the goods; quality inheritance, write a new chapter.
With the listing opportunity, Xindaxin Materials aims to “develop and produce silicon carbide powder products and become a superior supplier in the field of new energy and new materials”. Based on the company's technology and brand advantages, the company will become the company. The wafer cutting blade is the core competitiveness of the core products and the leading silicon carbide powder manufacturing base.
Xindaxin Materials will leverage the capital market to further enhance the company's overall strength and enhance the company's competitiveness and ability to withstand market risks on the basis of maintaining technological advantages. This will be another in the history of the development of new and new materials. An epoch-making milestone.
Silicone Material, Silicone Oil, Silicone Products
Changzhou Dahua-Luckypower
